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Month: May 2017

Types of processor package. PGA vs BGA vs LGA

BGA processors

PGA (pin grid array) is one type of processor packaging which offers more pins than DIP( dual inline package ). It’s a square or rectangular shape package. Pins are arranged in a matrix like manner at the bottom side of the processor. Pins are generally spaced 2.54 mm (0.1″) apart, and may or may not cover the entire underside of the package.

Jyotshna Electricals and Electronics