PGA (pin grid array) is one type of processor packaging which offers more pins than DIP( dual inline package ). It’s a square or rectangular shape package. Pins are arranged in a matrix like manner at the bottom side of the processor. Pins are generally spaced 2.54 mm (0.1″) apart, and may or may not cover the entire underside of the package.
Through hole type sockets are used the mount these type of processors on the PCB. Let’s have a look on both processor and its socket.
BGA or ball grid Array is a surface mount packaging of processors. This type of processor creates permanent connection with PCB. Processor contains small conductive balls at the place of pins in PGA. These balls creates electrical connection with PCB by soldering. BGA package provides good heat conductivity and less inductance between pads due to shorter length. These type of processors are commonly used in mobile devices. Let’s have a look.
LGA or land grid array is also a SMT packaging technology. In this case processor socket contains the pins. Let’s see the picture for clear understanding.